Todd Hubing Photo

Technical Papers Published in 2002

Estimating the Power Bus Impedance of Printed Circuit Boards with Embedded Capacitance
M. Xu and T. Hubing
IEEE Transactions on Advanced Packaging
vol. 25, no. 3, Aug. 2002, pp. 424-432.

On the Modeling of a Gapped Power Bus Structure using a Hybrid FEM/MOM Approach
Y. Ji and T. Hubing
IEEE Transactions on Electromagnetic Compatibility
vol. 44, no. 4, Nov. 2002, pp. 566-569.

Finite Element Modeling of Coaxial Cable Feeds and Vias in Power Bus Structures
H. Wang, Y. Ji and T. Hubing
IEEE Transactions on Electromagnetic Compatibility
vol. 44, no. 4, Nov. 2002, pp. 569-574.

Reducing Power Bus Impedance at Resonance with Lossy Components
T. Zeeff and T. Hubing
IEEE Transactions on Advanced Packaging
vol. 25, no. 2, May 2002, pp. 307-310.

On the Interior Resonance Problem when Applying a Hybrid FEM/MoM Approach to Model Printed Circuit Boards
Y. Ji and T. Hubing
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-44, no. 2, May 2002, pp. 318-323.

Power Bus Isolation using Power Islands in Printed Circuit Boards
J. Chen, T. Hubing, T. Van Doren, R. DuBroff
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-44, no. 2, May 2002, pp. 373-379.

Application of Higher-Order FEM Elements to the Analysis of Microstrip Structures
H. Wang, C. Guo, T. Hubing, J. Drewniak, T. Van Doren and R. DuBroff
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 1015-1019.

Decoupling Strategies for Printed Circuit Boards without Power Planes
H. W. Shim, T. Zeeff and T. Hubing
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 258-261.

An Expert System Architecture to Detect System-Level Automotive EMC Problems
S. Ranganathan, D. Beetner, R. Wiese and T. Hubing
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 976-981.

Field Extraction from Near Field Scanning for a Microstrip Structure
L. Zhang, K. Slattery, C. Wang, M. Yamaguchi, K. Arai, R. DuBroff, J. Drewniak, D. Pommerenke and T. Hubing
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 589-592.