Technical Papers Published in 2007
Characterizing the Electric-Field Coupling from IC-Heatsink
Structures to External Cables
using TEM-Cell Measurements
S. Deng, T. Hubing and D. Beetner
IEEE Trans. on Electromagnetic Compatibility
vol. 49, no. 4, Nov. 2007,
pp. 785-791.
Calculating Static Field and
Charge Distributions using Full-Wave Boundary Element
Methods
H. Ke and T. Hubing
IEEE Trans. on Magnetics
vol. 43, no. 4, Apr. 2007,
pp. 1245-1248.
Analysis of Radiated Emissions
from a Printed Circuit Board using Expert System
Algorithms
Y. Fu and T. Hubing
IEEE Transactions on Electromagnetic
Compatibility
vol. 49, no. 1, Feb. 2007, pp. 68-75.
Building IC Models Based on Measurements and Using these Models Productively
T. Hubing
Proc. of the 6th International Workshop on EMC of Integrated Circuits (EMC Compo 2007)
Turin, Italy, Nov. 2007, pp. 15-18.
Using Electric and Magnetic Moments to Characterize IC Coupling
to Cables and Enclosures
T. Hubing, S. Deng and D. Beetner
Proc. of the 6th International Workshop on EMC of Integrated Circuits (EMC Compo 2007)
Turin, Italy, Nov. 2007, pp. 159-162.
Plate Orientation Effect on the Inductance of Multi-layer
Ceramic Capacitors
H. Kwak, H. Ke, B. Lee and T. Hubing
Proc. of the 16th Topical Meeting on Electrical Performance of Electronic Packaging
Atlanta, Georgia, Oct. 2007, pp. 95-98.
An Improved Model for Representing Current Waveforms in CMOS Circuits
Y. Fu, G. Burbui and T. Hubing
Proc. of the 18th International Zurich Symposium on Electromagnetic Compatibility
Munich, Germany, Sep. 2007, pp. 289-292.
Circuit Board Layout for Automotive Electronics
T. Hubing
Proc. of the 2007 IEEE International
Symposium on Electromagnetic
Compatibility
Honolulu, HI, USA, July, 2007.
Validation of Worst-Case and Statistical
Models for an Automotive EMC Expert System
D. Beetner, H. Weng, M. Wu and T. Hubing
Proc. of the 2007 IEEE International
Symposium on Electromagnetic
Compatibility
Honolulu, HI, USA, July, 2007.
Mode Suppressed TEM Cell Design for
High Frequency IC Measurements
S. Deng, D. Pommerenke, T. Hubing, J. Drewniak, D. Beetner,
D. Shin, S. Kim, and H. Kwak
Proc. of the 2007 IEEE International
Symposium on Electromagnetic
Compatibility
Honolulu, HI, USA, July, 2007.
EMC of Integrated Circuits: A Historical
Review
E. Sicard, S. Ben Dhia, M. Ramdani and T. Hubing
Proc. of the 2007 IEEE International
Symposium on Electromagnetic
Compatibility
Honolulu, HI, USA, July, 2007.
Coupling Analysis of PCB-Chassis Systems
with Signal Lines and Via Structures using SPICE
N. Kobayashi, K. Morishita, M. Kusumoto, T. Harada and T. Hubing
Proc. of the 2007 IEEE International
Symposium on Electromagnetic
Compatibility
Honolulu, HI, USA, July, 2007.
